Detailed Notes on Noohapou
Detailed Notes on Noohapou
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Remote spots: Static models are generally located remotely, expanding Expense and reducing General technique effectiveness.
thirty% of its peak electricity use, offering our prospects important reduction in operating expenses and improved trustworthiness.
the knowledge underneath is classified by semiconductor procedure and tool producer. Just about every table consists of an Applications Matrix that reveals qulified and commercial processes.
initially Started in 1985, our organization has grown into a identified leader in providing temperature Management methods to the worldwide semiconductor sector.
LAUDA-Noah will, for your buyer's retrofit evaluation, keep an eye on and regulate its fluid temperature Handle profiles to match an current TCUs' if you want to guarantee a easy method integration through DAQ.
The accuracy with the POU 3300 allows for unbiased control of the method fluid temperature for the wafer chuck in just +/- 0.one °C of established issue, and the fast response time with the technique lets for optimum wafer-to-wafer repeatability through the entire etch process.
The accuracy from the POU 3500 permits unbiased control of the process fluid temperature for the wafer chuck inside of +/- 0.1 °C of established point, and also the fast reaction time of your process allows for optimum wafer-to-wafer repeatability all over the etch procedure.
Using the POU3300, you could realize unparalleled brings about etch efficiency, chamber uptime, minimized price of ownership and fab House utilization – all though improving upon your process reliability.
the information pertains to a 300mm chamber temperature profile in the course of a superior element ratio Etch process, functioning at very higher RF electricity disorders (~3.8kW). The compelling areas of this details set are:
Dynamic Temperature Regulate, as applied in programs like the LAUDA-Noah POU, is surely an strategy that senses the temperature of the procedure fluid getting back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature with the equipped process fluid based on this serious-time feedback.
The TEs' can switch straight from heating to cooling, or visa-versa. they're more info able to turn on & off when while in the heating or cooling mode and might boost or decrease the quantity of heating or cooling with out switching whatsoever.
over at any time, shrinking device geometries, demanding new processes and a highly competitive environment have to have temperature Regulate programs that combine quick and precise temperature Handle having an emphasis on decreased running costs and improved trustworthiness.
Confirmed; TEs' signify just one Element of a chiller's design. The switching & Management solutions used by a chiller will influence the TEs' reliability.
(Therefore, installing a static unit beside chamber is not going to permit it to supply dynamic temperature Management)
We call for much less cooling/heating capacity for the same software being a static TCU as a result of our modest reservoir volume.
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